BlankN = Narrow SOIC8 (150mil)W = Wide SOIC8 (208mil)Y1 = 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded,Miniature Array Package (MAP)Y6 = 8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP,Dual No Lead package (DFN), (MLP 2x3 mm)U3 = 8-ball, die Ball Grid Array Package (dBGA2)D3 = 8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
C = Std. paste containing Pb,Commercial Temperature range (0°C to 70°C)I = Std. paste containing Pb,Industrial Temperature range (-40°C to +85°C)H = Green, NiPdAu lead finish,Industrial Temperature range (-40°C to +85°C)U = Green, matte Sn lead finish,Industrial Temperature range (-40°C to +85°C)
XX
Operating Voltage
Blank = 4.5V to 5.5V2.7 = 2.7V to 5.5V2.5 = 2.5V to 5.5V1.8 = 1.8V to 5.5V
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.